Welcome to our Mi 9 Global Dual SIM TD LTE 128GB M1902F1G Specification Page, your gateway to unlocking the intricacies of cutting-edge technology. Here, you'll discover a curated collection of detailed specifications that unveil the essence of each device's capabilities. Dive into a world where technical details become stories, guiding you through the features and functionalities that shape your device experience. From processors to cameras, screen resolutions to battery life, this comprehensive resource aims to empower your understanding, assisting you in making informed decisions tailored to your unique preferences and needs. Explore and immerse yourself in a landscape where every specification serves as a stepping stone towards discovering the perfect device for your lifestyle.
"2019 flagship model of the Mi product line for the international market. High-end SDM855 AP, 48 MP main camera, in-display fingerprint sensor and holographic glass body. 6 GiB RAM / 128 GB UFS 2.1 storage"
Released | Date | Mar 2019 |
Code Name | Xiaomi Cepheus | |
Hardware Designer | Xiaomi | |
Manufacturer | Foxconn |
Operative System | OS | Google Android 9.0 (Pie) |
Hardware | CPU | Qualcomm Snapdragon 855 SM8150 (Hana) |
Storage | 128 GB | |
RAM | 6 GB |
Camera | Main camera | 48.0 MP |
Resolution | 8000x6000 | |
Aux camera | 19.9 MP | |
Resolution | 5184x3840 | |
Focus | No | |
Aperture | f/2.00 | |
Video recording | 3840x2160 | |
Video frame | 60 |
Battery | Type | Li-ion polymer (LiPo) |
Capacity | 3300mAh |
Network | |
---|---|
2G Bands | GSM850 GSM900 GSM1800 GSM1900 |
3G Bands | UMTS850 (B5) UMTS900 (B8) UMTS1700/2100 (B4) UMTS1900 (B2) UMTS2100 (B1) |
4G Bands | LTE2100 (B1) LTE1700/2100 (B4) LTE850 (B5) LTE1800 (B3) LTE2600 (B7) LTE1900 (B2) LTE900 (B8) LTE800 (B20) LTE700 (B12) LTE700 (B28) TD-LTE2600 (B38) TD-LTE2300 (B40) TD-LTE1900 (B39) |